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BXpa Pre-aligner
The BXpa wafer pre-aligner is the industry leader for speed and accuracy. The BXpa can achieve wafer orientations within a +/-.04 degree of accuracy and under one second, utilizing CCD array technology. It is available for use with 200 or 300 mm wafer sizes and comes with vacuum chuck as standard.
The BXpa features plug-and-play integration with the BX Controller and is furnished with a fully connectorized cable set. In just a few minutes the BXpa can be installed, configured, and operational.
CCD Array Technology
- Plug-and-Play with BX controller – no external power source needed
- Direct Control via BX controller – resulting in higher performance than serially controlled aligners
- Small, compact form factor for both 200mm and 300mm
- Higher tool yield via better precision
- Higher productivity via fast wafer orientation
- Accelerated production start via quick tool set-up
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