Berkeley's innovative solutions design capabilities, and flexible automation products, have been successfully applied to complex semiconductor wafer- and wafer carrier-handling challenges. Several 300 mm solutions have been described in trade press articles.

A 13 FOUP (Front-Opening Unified Pod) buffer and integrated high-throughput 300 mm wet bench front-end employing Autocalibration® technology to speed installation and repair.
"Space Constraints Yield Faster, Simple Handling For 300 mm Wafers" - Design News, June 5, 2000 *
(PDF - 2049k)

Advanced control architecture boosts throughput of four robot 300 mm front-end.
"Robots Perform In Parallel" - Design News, April 23, 2001 *
(PDF - 2187k)

Two case studies detail considerations and tradeoffs in controls design for semiconductor wafer-handling systems.
"Using An Integrated Controller To Manage Wafer-Handling Systems" - MICRO, September 2001 *
(PDF - 260k)

*Reprinted by permission of copyright holders Cahners Business Information, Cahners Business Information, and Canon Communications, respectively.