A leading innovator and provider of flexible automation solutions
 
 

 

 
 
Robotics Solutions
  • Control of popular, and OEM designed, wafer-handling robots
    —belted and direct drive designs
  • Improved wafer-handling equipment reliability, maintainability,
    and performance
  • Increased flexibility in wafer-handling component selection
  • 'Drop-in replacement' ease of adoption
  • Autocalibration® technology eliminates robot teaching
BERKELEY DELIVERS AUTOCALIBRATION® TECHNOLOGY-ENABLED DIRECT DRIVE ROBOT TO MAJOR SEMICONDUCTOR OEM

(Marriage Of Best-Of-Class Controls and Robot Technologies Improves Productivity & Performance, With No Changes To OEM's Control Architecture Or Software)

RICHMOND, Calif., October 8, 2002 - Berkeley Process Control, Inc. (Berkeley) announced today that it has delivered its patented Autocalibration® technology integrated with a major semiconductor equipment OEM's preferred direct drive wafer-handling robot. This is Berkeley's first integration of the particular state-of-the-art robot.

Autocalibration technology improves semiconductor fab equipment productivity by automating critical robot calibration processes that are conventionally performed by technicians using time-consuming and subjective manual methods. Calibration that previously required many hours is reduced to just minutes—substantially reducing costly production downtime. Subjectivity is eliminated, resulting in highly repeatable calibration, improved tool reliability, and reduced risk of damage to valuable semiconductor wafers.

State-of-the-art direct drive wafer-handling robots demonstrate better performance and reliability than their predecessors. They are, however, commonly delivered with controllers incapable of Autocalibration technology. Recently, key OEMs and end-users have begun to drive the marriage of best-of-class controls and robot technologies to improve fab tool productivity and performance.

Berkeley's integration of its flexible BX2 motion-and-machine controller with the OEM's chosen robot provided "drop-in replacement" ease of adoption. No changes to the OEM's tool control architecture or host software were required. The addition of a single host command enabled host initiation of the Autocalibration sequence.
BX-300 Wafer Handling (PDF)
BX-300 (PDF)
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