|
Semiconductor Wafer Handling Solutions
Moog offers unique solutions for the semiconductor wafer handling market. Moog’s versatile machine and motion controller BX-300 along with its patented Autocalibration, Dynamic Wafer Centering technologies, Semiconductor Tool Kit software and BX-Pa aligner can be combined in to a powerful wafer handling solution resulting in higher tool productivity and wafer yields.
Vacuum Tool Upgrade Kit |
Moog has designed an intelligent upgrade kit that expands the functional and useful life of semiconductor vacuum equipment allowing you to transform a single purpose tool into a hybrid or bridge tool
Read more about Vacuum Tool Upgrade Kit |
Wafer Processing Control Solutions |
Getting a new semiconductor tool to market on time is vital for success. Ever-increasing demands for process yields, tool reliability, and productivity, are however at odds with the software development time required to insure them.
Read more about wafer processing control solutions |
Autocalibration® Technology |
Autocalibration simplifies, speeds, and improves robot calibration. It is typically 10X more repeatable than manual teaching, and takes only minutes.
- Improved maintainability
- Improved reliability
- Reduced downtime
Read more about autocalibration technology |
Semiconductor Toolkit |
The Semiconductor Toolkit provides wafer-handling software utilities that run with Moog’s standard motion-and-machine control products. This product brings configurable, modular, parametric code to the user.
Autocalibration, wafer mapping, robot health checks and more can be configured in minutes, while the toolkit configures the code. This feature virtually eliminates the need for user programming and brings patented features such as Autocalibration technology to the user in an easy to configure utility toolkit.
|
Front-End Wafer Handling Systems and FOUP Buffers |
Moog’s innovative solutions design capabilities, and flexible automation products, have been successfully applied to complex semiconductor wafer- and wafer carrier-handling challenges. Several 300 mm solutions have been described in trade press articles.
A 13 FOUP (Front-Opening Unified Pod) buffer and integrated high-throughput 300 mm wet bench front-end employing Autocalibration® technology to speed installation and repair:
"Space Constraints Yield Faster, Simple Handling For 300 mm Wafers" - Design News, June 5, 2000 *
(PDF - 2049k)
Advanced control architecture boosts throughput of four robot 300 mm front-end.
Two case studies detail considerations and tradeoffs in controls design for semiconductor wafer-handling systems.
|
| *Reprinted by permission of copyright holders Cahners Business Information, Cahners Business Information, and Canon Communications, respectively. |
Robotics Solutions |
- Control of popular, and OEM designed, wafer-handling robots -belted and direct drive designs
- Improved wafer-handling equipment reliability, maintainability, and performance
- Increased flexibility in wafer-handling component selection
- ‘Drop-in replacement’ ease of adoption
- Autocalibration® technology eliminates robot teaching
|
| *Reprinted by permission of copyright holders Cahners Business Information, Cahners Business Information, and Canon Communications, respectively. |
|
|
Visit Moog Industrial